Inventor
CHIDAMBARAM VIVEK
SG4 patents
Patents
4 patentsUS9240362B2Jan 19, 2016
Layer arrangement and a wafer level package comprising the layer arrangement
AGENCY SCIENCE TECH & RES3 citations68
US9841399B2Dec 12, 2017
Chemical sensor package for highly pressured environment
AGENCY SCIENCE TECH & RES0 citations42
US9431315B2Aug 30, 2016
Chemical sensor package for highly pressured environment
AGENCY SCIENCE TECH & RES1 citations42
US10134607B2Nov 20, 2018
Method for low temperature bonding of wafers
AGENCY SCIENCE TECH & RES0 citations32