Inventor

CHEN BANGTAO

SG2 patents

⚠️ This page may combine multiple inventors who share the name “CHEN BANGTAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AGENCY SCIENCE TECH & RES

1 patent

US9240362B2Jan 19, 2016

Layer arrangement and a wafer level package comprising the layer arrangement

AGENCY SCIENCE TECH & RES3 citations68

WUHAN MEMSONICS TECH CO LTD

1 patent

US11799440B2Oct 24, 2023

Packaging structure and method of acoustic device

WUHAN MEMSONICS TECH CO LTD0 citations38