Inventor

CHIANG YI-CHE

TW15 patents

⚠️ This page may combine multiple inventors who share the name “CHIANG YI-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

14 patents

US11444023B2Sep 13, 2022

Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US10818588B2Oct 27, 2020

Semiconductor device, package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84

US10312203B2Jun 4, 2019

Structure and formation method of chip package with antenna element

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84

US12021024B2Jun 25, 2024

Semiconductor device including a semiconductor die and a plurality of antenna patterns

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

US11705411B2Jul 18, 2023

Method of fabricating package structure including a plurality of antenna patterns

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11373922B2Jun 28, 2022

Semiconductor packages having thermal through vias (TTV)

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11018113B2May 25, 2021

Memory module, semiconductor package including the same, and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

US10937719B2Mar 2, 2021

Package structure and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12406941B2Sep 2, 2025

Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

1 patent

US12599018B2Apr 7, 2026

Package structure with enhancement structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG COMPANY LTD0 citations50

CHIANG YI-CHE

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device

Semiconductor device, package structure and method of fabricating the same

Structure and formation method of chip package with antenna element

Semiconductor device including a semiconductor die and a plurality of antenna patterns

Chip package with antenna element

Semiconductor package and manufacturing method thereof

Chip package with antenna element

Semiconductor packages having thermal through vias (TTV)

Package structure with antenna element

Method of fabricating package structure including a plurality of antenna patterns

Semiconductor packages having thermal through vias (TTV)

Memory module, semiconductor package including the same, and manufacturing method thereof

Package structure and method of fabricating the same

Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Package structure with enhancement structure and manufacturing method thereof