Inventor

HSIAO MIN-CHIEN

TW19 patents

⚠️ This page may combine multiple inventors who share the name “HSIAO MIN-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIAO MIN-CHIEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Structure and formation method of chip package with antenna element

Chip package with antenna element

Semiconductor structure and method of fabricating the same

Package structure and manufacturing method thereof

Chip package with antenna element

Package structure, electronic device and method of fabricating package structure

Semiconductor structure and method manufacturing the same

Package structure with antenna element

Methods of fabricating package structure

Methods of fabricating the same die stack structure and semiconductor structure

Die stack structure, semiconductor structure and method of fabricating the same

Package structure, electronic device and method of fabricating package structure

Semiconductor structure and manufacturing method thereof

Package structure and method of fabricating the same

Package structure, electronic device and method of fabricating package structure

Semiconductor structure and manufacturing method thereof

3D package with through substrate vias

TAIWAN SEMICONDUCTOR MFG

3D package with through substrate vias

MA CHEN-CHI MARTIN

Composite substrate for counter electrode of dye-sensitized solar cell