Inventor

SHIH CHAO-WEN

TW140 patents

⚠️ This page may combine multiple inventors who share the name “SHIH CHAO-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIH CHAO-WEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Packaging of semiconductor device with antenna and heat spreader

Integrated devices in semiconductor packages and methods of forming same

Package structure and manufacturing method thereof

Sensor packages and manufacturing mehtods thereof

Method for manufacturing a semiconductor device having an interconnect structure over a substrate

Integrated circuit package and method

Package structure and method of manufacturing the same

Integrated circuit package and method

Package and method of fabricating the same

Package structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor packages and method of forming the same

Semiconductor packages and manufacturing methods thereof

Package structure

Structure and formation method of chip package with antenna element

Method of manufacturing integrated fan-out package

Copper post structure for wafer level chip scale package

Semiconductor packages

Manufacturing method of semiconductor structure

Semiconductor packages and manufacturing methods thereof

Stacking structure, package structure and method of fabricating the same

Semiconductor device having antenna on chip package and manufacturing method thereof

Chip package with antenna element

Package having multiple chips integrated therein and manufacturing method thereof

Three-dimensional stacking structure and manufacturing method thereof

Package structure and method of fabricating the same

Semiconductor structure and method of fabricating the same

Package structure and manufacturing method thereof

Stacking structure, package structure and method of fabricating the same

Package structure, chip structure and method of fabricating the same

Package and manufacturing method of reconstructed wafer

Chip package with antenna element

Semiconductor package structure

Semiconductor packages and manufacturing methods thereof

Integrated devices in semiconductor packages and methods of forming same

Conductive traces in semiconductor devices and methods of forming same

Semiconductor device and manufacturing method thereof

Semiconductor structures and methods of forming the same

Package structure, package-on-package structure and method of fabricating the same

PHOENIX PREC TECHNOLOGY CORP

Method for fabricating connection terminal of circuit board

Circuit board with identifiable information and method for fabricating the same

Method of fabricating circuit board having different electrical connection structures

TAIWAN SEMICONDUCTOR MFG

3D semiconductor package interposer with die cavity

3D package with through substrate vias

UNIMICRON TECHNOLOGY CORP

Circuit board structure and fabrication method thereof

Circuit board structure

JENG SHIN-PUU

3D semiconductor package interposer with die cavity

WU WEI-CHENG

Semiconductor device having pad structure with stress buffer layer

HON HAI PREC IND CO LTD

Automatic pill grasping apparatus

YANG CHUNG-YING

Package-on-package structures with reduced bump bridging