Inventor
KATOH KIMIKAZU
JP3 patents
Patents
3 patentsUS5413838AMay 9, 1995
Both-side roughened copper foil with protection film
SUMITOMO BAKELITE CO24 citations89
US5320919AJun 14, 1994
Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same
SUMITOMO BAKELITE CO19 citations79
US5286330AFeb 15, 1994
Method of producing copper-clad laminated board
SUMITOMO BAKELITE CO14 citations70