Inventor
PARK MYUNG JUN
KR80 patents
⚠️ This page may combine multiple inventors who share the name “PARK MYUNG JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
39 patentsUS10366834B1Jul 30, 2019
Ceramic electronic component
SAMSUNG ELECTRO MECH67 citations97
US11239032B2Feb 1, 2022
Capacitor component
SAMSUNG ELECTRO MECH6 citations86
US11587735B2Feb 21, 2023
Multilayer electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH8 citations84
US9424990B2Aug 23, 2016
Multilayered ceramic capacitor and board for mounting the same
SAMSUNG ELECTRO MECH7 citations84
US10388447B2Aug 20, 2019
Multilayer seed pattern inductor, manufacturing method thereof, and board having the same
SAMSUNG ELECTRO MECH8 citations83
US10614943B2Apr 7, 2020
Multilayer seed pattern inductor and manufacturing method thereof
SAMSUNG ELECTRO MECH7 citations82
US11651899B2May 16, 2023
Capacitor component
SAMSUNG ELECTRO MECH1 citations73
US11348732B2May 31, 2022
Capacitor component
SAMSUNG ELECTRO MECH5 citations73
US11342123B2May 24, 2022
Multi-layered ceramic electronic component
SAMSUNG ELECTRO MECH2 citations73
US11264170B2Mar 1, 2022
Capacitor component
SAMSUNG ELECTRO MECH3 citations73
US10886066B2Jan 5, 2021
Multilayer ceramic capacitor including external electrode having tin-plated layers alternately stacked with nickel-plated layer(s)
SAMSUNG ELECTRO MECH2 citations73
US9343235B2May 17, 2016
Multilayer ceramic capacitor and assembly board having the same
SAMSUNG ELECTRO MECH5 citations73
US10861651B2Dec 8, 2020
Multilayer capacitor
SAMSUNG ELECTRO MECH3 citations72
US9743514B2Aug 22, 2017
Multilayer ceramic electronic component, method of manufacturing the same, and circuit board having the same
SAMSUNG ELECTRO MECH3 citations72
US9214278B2Dec 15, 2015
Multilayered ceramic electronic component and board for mounting the same
SAMSUNG ELECTRO MECH6 citations72
US12170170B2Dec 17, 2024
Multilayer electronic component
SAMSUNG ELECTRO MECH2 citations71
US10319515B2Jun 11, 2019
Chip electronic component
SAMSUNG ELECTRO MECH3 citations71
US10163568B2Dec 25, 2018
Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon
SAMSUNG ELECTRO MECH2 citations71
US9159495B2Oct 13, 2015
Multilayer ceramic electronic component, manufacturing method thereof and board for mounting the same
SAMSUNG ELECTRO MECH5 citations69
US9875849B2Jan 23, 2018
Multilayer ceramic electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH5 citations67
US12020869B2Jun 25, 2024
Multilayer electronic component having improved electrode structure for increased capacity per unit volume
SAMSUNG ELECTRO MECH2 citations65
US11699554B2Jul 11, 2023
Multi-layered ceramic electronic component
SAMSUNG ELECTRO MECH0 citations63
US11935701B2Mar 19, 2024
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US11657978B2May 23, 2023
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US11646161B2May 9, 2023
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US11302477B2Apr 12, 2022
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US10910162B2Feb 2, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US10896782B2Jan 19, 2021
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US10818436B2Oct 27, 2020
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations62
US10312022B2Jun 4, 2019
Capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations62
US12525402B2Jan 13, 2026
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US12340945B2Jun 24, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US11901130B2Feb 13, 2024
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US11605484B2Mar 14, 2023
Multilayer seed pattern inductor and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations61
US11152155B2Oct 19, 2021
Capacitor component having secondary phase material contained in external electrode thereof
SAMSUNG ELECTRO MECH0 citations61
US10804034B2Oct 13, 2020
Capacitor component having secondary phase material contained in external electrode thereof
SAMSUNG ELECTRO MECH1 citations61
US10790087B2Sep 29, 2020
Multilayer ceramic electronic part having external electrode including conductive resin layer and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations61
US11302478B2Apr 12, 2022
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH0 citations60
US11842853B2Dec 12, 2023
Multilayered electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations59
PARK MYUNG JUN
5 patentsUS8941972B2Jan 27, 2015
Multilayer ceramic electronic component
PARK MYUNG JUN9 citations83
US8842413B2Sep 23, 2014
Multilayered ceramic electronic component
PARK MYUNG JUN8 citations81
US8941971B2Jan 27, 2015
Multilayer ceramic electronic component and fabrication method thereof
PARK MYUNG JUN4 citations72
US8767375B2Jul 1, 2014
Multilayer ceramic electronic component and method of fabricating the same
PARK MYUNG JUN2 citations61
US8675343B2Mar 18, 2014
Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereof
PARK MYUNG JUN2 citations61
JEON BYUNG JUN
2 patentsGU HYUN HEE
1 patentKANG SUNG KOO
1 patentSAMSUNG ELECTRONICS CO LTD
1 patentLEE JONG HO
1 patentShowing the top 50 of 80 patents by PatentIndex Score.