Inventor
WORKMAN DEREK B
US9 patents
Patents
9 patentsUS6660560B2Dec 9, 2003
No-flow underfill material and underfill method for flip chip devices
DELPHI TECH INC77 citations96
US6943058B2Sep 13, 2005
No-flow underfill process and material therefor
DELPHI TECH INC24 citations92
US7331106B2Feb 19, 2008
Underfill method
DELPHI TECH INC11 citations76
US7119449B2Oct 10, 2006
Enhancement of underfill physical properties by the addition of thermotropic cellulose
DELPHI TECH INC6 citations61
US7790814B2Sep 7, 2010
Radiopaque polymers for circuit board assembly
DELPHI TECH INC5 citations60
US7498197B2Mar 3, 2009
Silica nanoparticles thermoset resin compositions
DELPHI TECH INC2 citations60
US7205652B2Apr 17, 2007
Electronic assembly including multiple substrates
DELPHI TECH INC1 citations50
US7202571B2Apr 10, 2007
Electronic module with form in-place pedestal
DELPHI TECH INC0 citations50
US7754824B2Jul 13, 2010
Dendritic polyol, cycloaliphatic epoxy resin and cationic initiator
DELPHI TECH INC0 citations49