Inventor
GU HYUN HEE
KR53 patents
⚠️ This page may combine multiple inventors who share the name “GU HYUN HEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
41 patentsUS11239032B2Feb 1, 2022
Capacitor component
SAMSUNG ELECTRO MECH6 citations86
US11587735B2Feb 21, 2023
Multilayer electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH8 citations84
US9974183B2May 15, 2018
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH10 citations84
US9439301B2Sep 6, 2016
Multilayered chip electronic component and board for mounting the same
SAMSUNG ELECTRO MECH8 citations84
US9818547B1Nov 14, 2017
Multilayer ceramic electronic component and board having the same
SAMSUNG ELECTRO MECH8 citations82
US10573460B2Feb 25, 2020
Multilayer ceramic electronic component and board for mounting of the same
SAMSUNG ELECTRO MECH5 citations81
US11651899B2May 16, 2023
Capacitor component
SAMSUNG ELECTRO MECH1 citations73
US11348732B2May 31, 2022
Capacitor component
SAMSUNG ELECTRO MECH5 citations73
US11342123B2May 24, 2022
Multi-layered ceramic electronic component
SAMSUNG ELECTRO MECH2 citations73
US11264170B2Mar 1, 2022
Capacitor component
SAMSUNG ELECTRO MECH3 citations73
US10886066B2Jan 5, 2021
Multilayer ceramic capacitor including external electrode having tin-plated layers alternately stacked with nickel-plated layer(s)
SAMSUNG ELECTRO MECH2 citations73
US10535469B1Jan 14, 2020
Ceramic electronic component
SAMSUNG ELECTRO MECH3 citations73
US10529492B1Jan 7, 2020
Ceramic electronic component
SAMSUNG ELECTRO MECH3 citations73
US10373759B1Aug 6, 2019
Multilayer ceramic electronic component having external electrodes with holes in plating layers
SAMSUNG ELECTRO MECH4 citations73
US10062506B2Aug 28, 2018
Capacitor and method of manufacturing same
SAMSUNG ELECTRO MECH2 citations73
US9743514B2Aug 22, 2017
Multilayer ceramic electronic component, method of manufacturing the same, and circuit board having the same
SAMSUNG ELECTRO MECH3 citations72
US9019690B2Apr 28, 2015
Conductive resin composition, multilayer ceramic capacitor having the same, and method of manufacturing the multilayer ceramic capacitor
SAMSUNG ELECTRO MECH5 citations72
US9318264B2Apr 19, 2016
Multilayer ceramic device
SAMSUNG ELECTRO MECH6 citations71
US10187994B2Jan 22, 2019
Capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations69
US11699554B2Jul 11, 2023
Multi-layered ceramic electronic component
SAMSUNG ELECTRO MECH0 citations63
US11935701B2Mar 19, 2024
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US11657978B2May 23, 2023
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US11646161B2May 9, 2023
Capacitor component
SAMSUNG ELECTRO MECH0 citations62
US10978250B2Apr 13, 2021
Method of manufacturing capacitor
SAMSUNG ELECTRO MECH0 citations62
US10892101B2Jan 12, 2021
Multilayer ceramic capacitor
SAMSUNG ELECTRO MECH1 citations62
US10886068B2Jan 5, 2021
Ceramic electronic component
SAMSUNG ELECTRO MECH0 citations62
US10861650B2Dec 8, 2020
Multilayer ceramic electronic component and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations62
US12340945B2Jun 24, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US11901130B2Feb 13, 2024
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations61
US9343232B2May 17, 2016
Conductive paste composition for external electrode and multilayer ceramic electronic component including the same
SAMSUNG ELECTRO MECH2 citations61
US9218909B2Dec 22, 2015
Multi-layered ceramic electronic component
SAMSUNG ELECTRO MECH2 citations61
US11682526B2Jun 20, 2023
Multilayer ceramic electronic component and board for mounting of the same
SAMSUNG ELECTRO MECH0 citations59
US11069481B2Jul 20, 2021
Multilayer ceramic electronic component and board for mounting of the same
SAMSUNG ELECTRO MECH0 citations59
US10580578B1Mar 3, 2020
Multilayer ceramic electronic component having external electrode layers with holes
SAMSUNG ELECTRO MECH0 citations52
US9514882B2Dec 6, 2016
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH0 citations52
US9305705B2Apr 5, 2016
Multilayer ceramic electronic component
SAMSUNG ELECTRO MECH1 citations52
US12374498B2Jul 29, 2025
Multilayer electronic component
SAMSUNG ELECTRO MECH0 citations51
US11476051B2Oct 18, 2022
Multilayer ceramic electronic component and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations51
US10199133B2Feb 5, 2019
Conductive resin composition and multilayer ceramic capacitor having the same
SAMSUNG ELECTRO MECH0 citations51
US12400794B2Aug 26, 2025
Ceramic electronic component
SAMSUNG ELECTRO MECH0 citations49
US10537025B2Jan 14, 2020
Capacitor and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations48
PARK MYUNG JUN
5 patentsUS8941972B2Jan 27, 2015
Multilayer ceramic electronic component
PARK MYUNG JUN9 citations83
US8842413B2Sep 23, 2014
Multilayered ceramic electronic component
PARK MYUNG JUN8 citations81
US8941971B2Jan 27, 2015
Multilayer ceramic electronic component and fabrication method thereof
PARK MYUNG JUN4 citations72
US8767375B2Jul 1, 2014
Multilayer ceramic electronic component and method of fabricating the same
PARK MYUNG JUN2 citations61
US8675343B2Mar 18, 2014
Conductive paste for external electrode, multilayered ceramic electronic component using the same and fabrication method thereof
PARK MYUNG JUN2 citations61
JEON BYUNG JUN
2 patentsGU HYUN HEE
1 patentKANG SUNG KOO
1 patentShowing the top 50 of 53 patents by PatentIndex Score.