Inventor
LIU PILIN
US5 patents
⚠️ This page may combine multiple inventors who share the name “LIU PILIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS11387175B2Jul 12, 2022
Interposer package-on-package (PoP) with solder array thermal contacts
INTEL CORP6 citations72
US10361167B2Jul 23, 2019
Electronic assembly using bismuth-rich solder
INTEL CORP4 citations70
US12598989B2Apr 7, 2026
Package structures with patterned die backside layer
INTEL CORP0 citations60
US8013444B2Sep 6, 2011
Solder joints with enhanced electromigration resistance
INTEL CORP4 citations59