Inventor
KUO SHENG-LIANG
TW10 patents
⚠️ This page may combine multiple inventors who share the name “KUO SHENG-LIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
7 patentsUS10942067B2Mar 9, 2021
Method and apparatus for surface and ambient temperature estimation for portable devices
MEDIATEK INC6 citations82
US10573579B2Feb 25, 2020
Semiconductor package with improved heat dissipation
MEDIATEK INC10 citations82
US11640930B2May 2, 2023
Semiconductor package having liquid-cooling lid
MEDIATEK INC2 citations71
US11302592B2Apr 12, 2022
Semiconductor package having a stiffener ring
MEDIATEK INC4 citations71
US12300573B2May 13, 2025
Semiconductor device and manufacturing method thereof
MEDIATEK INC0 citations61
US12087664B2Sep 10, 2024
Semiconductor package having liquid-cooling lid
MEDIATEK INC1 citations60
US10739206B2Aug 11, 2020
Method and apparatus for surface and ambient temperature estimation for portable devices
MEDIATEK INC1 citations60
TAIWAN SEMICONDUCTOR MFG CO LTD
2 patentsUS12362258B2Jul 15, 2025
Thermal module for a semiconductor package and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12588505B2Mar 24, 2026
Thermal and mechanical enhanced thermal module structure on heterogeneous packages and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42