Inventor

MCBRIDE DONALD G

US27 patents

⚠️ This page may combine multiple inventors who share the name “MCBRIDE DONALD G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCBRIDE DONALD G

IBM

Flexible carrier for an electronic device

Full panel electronic packaging structure and method of making same

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Multi-layer flexible film module

Electronic package assembly method

Full panel electronic packaging structure

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Method of marking a thin film package

Flexible carrier for an electronic device

Multi-layer flexible film module

Flexible film semiconductor chip carrier

Process for preparing a substrate for subsequent electroless deposition of a metal

Method for conditioning halogenated polymeric materials and structures fabricated therewith

Method and apparatus for controlling the organic contamination level in an electroless plating bath

Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath

Method of depositing a metal from an electroless plating solution

Thin film package for mixed bonding of chips

Organic solder barrier

Method for stripping peel apart conductive structures

Structure including a partially electrochemically reduced halogenated polymeric containing layer and an electrically conductive pattern

Method for plating from an electroless plating bath

Decreasing plated metal defects

Fluid treatment device

Method for treating substrates

Copper plating

(unassigned)

Direct attachment of silicon chip to circuit carrier

Process for attaching a silicon chip to a circuit board using a block of encapsulated wires and the block of wires manufactured by the process