Inventor
KWON DONGUK
KR6 patents
Patents
6 patentsUS11676904B2Jun 13, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations67
US12272652B2Apr 8, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US11749592B2Sep 5, 2023
Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations53
US12406917B2Sep 2, 2025
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations45
US12463122B2Nov 4, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44
US12288745B2Apr 29, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations44