Inventor
TJOKRO NOVY
US7 patents
Patents
7 patentsUS9837312B1Dec 5, 2017
Atomic layer etching for enhanced bottom-up feature fill
LAM RES CORP48 citations93
US8603913B1Dec 10, 2013
Porous dielectrics K value restoration by thermal treatment and or solvent treatment
LAM RES CORP3 citations61
US12203168B2Jan 21, 2025
Metal deposition
LAM RES CORP1 citations60
US12077858B2Sep 3, 2024
Tungsten deposition
LAM RES CORP0 citations57
US10103056B2Oct 16, 2018
Methods for wet metal seed deposition for bottom up gapfill of features
LAM RES CORP0 citations51
US9142416B1Sep 22, 2015
Process to reduce nodule formation in electroless plating
LAM RES CORP0 citations48
US12060639B2Aug 13, 2024
Rapid flush purging during atomic layer deposition
LAM RES CORP0 citations47