Inventor

HORI YUTAKA

JP20 patents

⚠️ This page may combine multiple inventors who share the name “HORI YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HORI YUTAKA

NITTO ELECTRIC IND CO

Heat-activatable, pressure-sensitive adhesive tape or sheet

Plastic laminated metallic foil and method for preparing the same

Plastic laminated metallic foil and method for preparing the same

Heat-curable composite sheet and process for forming the same

Bonding method

Heat-curable composite adhesive sheet and method for making

Metal foil-plastic laminate and method of preparing the same

Pressure-sensitive adhesive composition

Process for radical polymerizing acrylic monomers

Electrically conductive adhesive tape

Method for coating metal surface

APPLE INC

Master/slave mode for sensor processing devices

Method to compensate for the frequency dependence of sense signal preprocessing

Multiplexing multiple serial interfaces

AICA KOGYO CO LTD

Methacrylate prepolymer containing triazine ring structure, its preparation, and setting composition and resin

Metharcylate prepolymer containing triazine ring structure, its preparation, and setting composition and resin

WILSON THOMAS JAMES

Memory access without internal microprocessor intervention

Low power digital interface

NITTO DENKO CORP

Depilation method

FUNAI ELECTRIC CO

Printer