Inventor
KIKUTA KUNIKO
JP28 patents
⚠️ This page may combine multiple inventors who share the name “KIKUTA KUNIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
13 patentsUS5691571ANov 25, 1997
Semiconductor device having fine contact hole with high aspect ratio
NEC CORP48 citations95
US6235583B1May 22, 2001
Non-volatile semiconductor memory and fabricating method therefor
NEC CORP23 citations92
US6359329B1Mar 19, 2002
Embedded wiring structure and method for forming the same
NEC CORP9 citations74
US6313030B1Nov 6, 2001
Method of making a conductive layer covering a hole of decreasing diameter in an insulation layer in a semiconductor device
NEC CORP6 citations74
US6051880AApr 18, 2000
Base layer structure covering a hole of decreasing diameter in an insulation layer in a semiconductor device
NEC CORP13 citations74
US4983534AJan 8, 1991
Semiconductor device and method of manufacturing the same
NEC CORP14 citations74
US6437394B1Aug 20, 2002
Non-volatile semiconductor memory device with reduced line resistance and method of manufacturing
NEC CORP9 citations73
US6417533B2Jul 9, 2002
Semiconductor device having capacitor which assures sufficient capacity without requiring large space and method of producing the same
NEC CORP7 citations73
US6114244ASep 5, 2000
Method for manufacturing a semiconductor device having fine contact hole with high aspect ratio
NEC CORP9 citations73
US7477538B2Jan 13, 2009
Magnetic random access memory
NEC CORP4 citations63
US6257960B1Jul 10, 2001
Lapping method and method for manufacturing lapping particles for use in the lapping method
NEC CORP2 citations63
US7239002B2Jul 3, 2007
Integrated circuit device
NEC CORP6 citations62
US6352468B2Mar 5, 2002
Lapping method and method for manufacturing lapping particles for use in the lapping method
NEC CORP0 citations52
NEC ELECTRONICS CORP
12 patentsUS7202567B2Apr 10, 2007
Semiconductor device and manufacturing method for the same
NEC ELECTRONICS CORP20 citations92
US6818991B1Nov 16, 2004
Copper-alloy interconnection layer
NEC ELECTRONICS CORP13 citations84
US7663207B2Feb 16, 2010
Semiconductor device
NEC ELECTRONICS CORP7 citations74
US7154158B2Dec 26, 2006
Semiconductor device having MIM structure resistor
NEC ELECTRONICS CORP7 citations74
US6746875B2Jun 8, 2004
Magnetic memory and method of its manufacture
NEC ELECTRONICS CORP8 citations74
US6633057B2Oct 14, 2003
Non-volatile semiconductor memory and fabricating method therefor
NEC ELECTRONICS CORP7 citations73
US7705422B2Apr 27, 2010
Semiconductor device including metal-insulator-metal capacitor arrangement
NEC ELECTRONICS CORP3 citations63
US7494867B2Feb 24, 2009
Semiconductor device having MIM capacitive elements and manufacturing method for the same
NEC ELECTRONICS CORP4 citations63
US7432170B2Oct 7, 2008
Semiconductor device and fabrication method thereof
NEC ELECTRONICS CORP5 citations63
US7554158B2Jun 30, 2009
Semiconductor device having analog and digital circuits
NEC ELECTRONICS CORP5 citations62
US6605507B2Aug 12, 2003
Non-volatile semiconductor memory device and manufacturing method thereof
NEC ELECTRONICS CORP4 citations62
US7777288B2Aug 17, 2010
Integrated circuit device and fabrication method therefor
NEC ELECTRONICS CORP0 citations41