Inventor

HECHT ILYA

IL2 patents

⚠️ This page may combine multiple inventors who share the name “HECHT ILYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TESSERA TECH IRELAND LTD

1 patent

US7936062B2May 3, 2011

Wafer level chip packaging

TESSERA TECH IRELAND LTD75 citations94

TESSERA TECH HUNGARY KFT

1 patent

US7807508B2Oct 5, 2010

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

TESSERA TECH HUNGARY KFT62 citations94