Inventor
SUSKO ROBIN A
US20 patents
⚠️ This page may combine multiple inventors who share the name “SUSKO ROBIN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
19 patentsUS6569711B1May 27, 2003
Methods and apparatus for balancing differences in thermal expansion in electronic packaging
IBM53 citations96
US5956235ASep 21, 1999
Method and apparatus for flexibly connecting electronic devices
IBM67 citations96
US4885074ADec 5, 1989
Plasma reactor having segmented electrodes
IBM110 citations96
US7709951B2May 4, 2010
Thermal pillow
IBM27 citations92
US6177728B1Jan 23, 2001
Integrated circuit chip device having balanced thermal expansion
IBM41 citations92
US6059579AMay 9, 2000
Semiconductor structure interconnector and assembly
IBM25 citations92
US5208067AMay 4, 1993
Surface modification of organic materials to improve adhesion
IBM28 citations92
US5189261AFeb 23, 1993
Electrical and/or thermal interconnections and methods for obtaining such
IBM52 citations89
US7795724B2Sep 14, 2010
Sandwiched organic LGA structure
IBM16 citations84
US4908094AMar 13, 1990
Method for laminating organic materials via surface modification
IBM19 citations81
US4654115AMar 31, 1987
Process for removing contaminant
IBM22 citations80
US7137826B2Nov 21, 2006
Temperature dependent semiconductor module connectors
IBM8 citations73
US7128579B1Oct 31, 2006
Hook interconnect
IBM7 citations73
US6228246B1May 8, 2001
Removal of metal skin from a copper-Invar-copper laminate
IBM7 citations73
US4715941ADec 29, 1987
Surface modification of organic materials to improve adhesion
IBM17 citations73
US4830706AMay 16, 1989
Method of making sloped vias
IBM18 citations72
US5039569AAug 13, 1991
Surface modification of organic materials to improve adhesion
IBM3 citations62
US7255571B2Aug 14, 2007
Temperature dependent semiconductor module connectors
IBM1 citations52
US8674506B2Mar 18, 2014
Structures and methods to reduce maximum current density in a solder ball
IBM1 citations51