Inventor
HO CHI-SHEN
US3 patents
Patents
3 patentsUS7078272B2Jul 18, 2006
Wafer scale integration packaging and method of making and using the same
APTOS CORP24 citations89
US7208344B2Apr 24, 2007
Wafer level mounting frame for ball grid array packaging, and method of making and using the same
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US7141875B2Nov 28, 2006
Flexible multi-chip module and method of making the same
APTOS CORP3 citations60