Inventor
CHIU JOEY
TW3 patents
Patents
3 patentsUS7132369B2Nov 7, 2006
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC27 citations92
US7435685B2Oct 14, 2008
Method of forming a low-K dual damascene interconnect structure
APPLIED MATERIALS INC13 citations83
US7256134B2Aug 14, 2007
Selective etching of carbon-doped low-k dielectrics
APPLIED MATERIALS INC16 citations82