Inventor
SRIKRISHNAN KRIS V
US19 patents
Patents
19 patentsUS7141853B2Nov 28, 2006
Method and structure for buried circuits and devices
IBM385 citations99
US6759282B2Jul 6, 2004
Method and structure for buried circuits and devices
IBM338 citations99
US5882987AMar 16, 1999
Smart-cut process for the production of thin semiconductor material films
IBM883 citations99
US5920764AJul 6, 1999
Process for restoring rejected wafers in line for reuse as new
IBM163 citations96
US5485032AJan 16, 1996
Antifuse element with electrical or optical programming
IBM61 citations96
US5371047ADec 6, 1994
Chip interconnection having a breathable etch stop layer
IBM73 citations96
US4471405ASep 11, 1984
Thin film capacitor with a dual bottom electrode structure
IBM57 citations96
US5372652ADec 13, 1994
Aerosol cleaning method
IBM66 citations95
US7491588B2Feb 17, 2009
Method and structure for buried circuits and devices
IBM17 citations92
US7320918B2Jan 22, 2008
Method and structure for buried circuits and devices
IBM14 citations92
US6326285B1Dec 4, 2001
Simultaneous multiple silicon on insulator (SOI) wafer production
IBM44 citations92
US5469981ANov 28, 1995
Electrically blowable fuse structure manufacturing for organic insulators
IBM27 citations92
US5420069AMay 30, 1995
Method of making corrosion resistant, low resistivity copper for interconnect metal lines
IBM30 citations92
US5389814AFeb 14, 1995
Electrically blowable fuse structure for organic insulators
IBM41 citations92
US4423087ADec 27, 1983
Thin film capacitor with a dual bottom electrode structure
IBM46 citations92
US5314840AMay 24, 1994
Method for forming an antifuse element with electrical or optical programming
IBM38 citations90
US4493856AJan 15, 1985
Selective coating of metallurgical features of a dielectric substrate with diverse metals
IBM25 citations82
US4839715AJun 13, 1989
Chip contacts without oxide discontinuities
IBM13 citations70
US4622205ANov 11, 1986
Electromigration lifetime increase of lead base alloys
IBM14 citations67