Inventor

KANAYAMA SHINJI

JP47 patents

⚠️ This page may combine multiple inventors who share the name “KANAYAMA SHINJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANAYAMA SHINJI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Component mounting method

Mounting apparatus for electronic component

Bump bonding method and bump bonding apparatus

Method and device for frictional connection and holding tool used for the frictional connection device

Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate

Method and apparatus for mounting component

Component feeder with load position alignment recognition

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Bump bonding apparatus and method

Component mounting method and apparatus

Linear actuating apparatus

Bump joining judging device and method, and semiconductor component production device and method

Method and apparatus for mounting electronic component

Apparatus and method for mounting component

Component mounting apparatus including a polishing device

Electronic component, component mounting equipment, and component mounting method

Pusher, puller loader, unloader, and working device

Bump bonding unit with tray storage and transport apparatuses

Working method for holding a work object by suction

Component mounting apparatus and component mounting method

Method and apparatus for handling arrayed part

Bump bonding apparatus and method

Method and apparatus for mounting component

Bump bonding apparatus and method

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

Method and apparatus for mounting component

Bump formation method and bump forming apparatus for semiconductor wafer

Device and method for forming bump

Bump joining method

Method and device for sealing IC chip

Method of bonding an external lead and a tool therefor

IC discarding apparatus for flip chip mounting facility

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore

Apparatus and method for forming bump

Method and apparatus for correcting inclination of IC on semiconductor wafer

Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate

Method of forming bumps on a wafer utilizing a post-heating operation, and apparatus therefor

Bump-joining method

Bonding apparatus for terminal component

Electronic component mounting method and apparatus and ultrasonic bonding head

PANASONIC CORP

Component mounting apparatus

Component mounting apparatus

Component mounting tool, and method and apparatus for mounting component using this tool

Bump formation method and bump forming apparatus for semiconductor wafer

Component mounting method, component mounting apparatus, and ultrasonic bonding head