Inventor

OHNAKADA SATOSHI

JP2 patents

Patents

2 patents

US5462626AOct 31, 1995

Method of bonding an external lead and a tool therefor

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations72

US5582341ADec 10, 1996

Bonding apparatus for terminal component

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD6 citations60