Inventor
COTEUS PAUL WILLIAM
US22 patents
⚠️ This page may combine multiple inventors who share the name “COTEUS PAUL WILLIAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
21 patentsUS5780925AJul 14, 1998
Lead frame package for electronic devices
IBM222 citations99
US5910883AJun 8, 1999
Hinge incorporating a helically coiled heat pipe for a laptop computer
IBM109 citations98
US6292903B1Sep 18, 2001
Smart memory interface
IBM249 citations97
US6518794B2Feb 11, 2003
AC drive cross point adjust method and apparatus
IBM82 citations95
US6202110B1Mar 13, 2001
Memory cards with symmetrical pinout for back-to-back mounting in computer system
IBM70 citations95
US7061821B2Jun 13, 2006
Address wrap function for addressable memory devices
IBM26 citations93
US6127840AOct 3, 2000
Dynamic line termination clamping circuit
IBM27 citations92
US5863447AJan 26, 1999
Method for providing a selective reference layer isolation technique for the production of printed circuit boards
IBM28 citations92
US5688147ANov 18, 1997
Interchangeable key card edge connecting
IBM26 citations92
US6098176AAug 1, 2000
Sinusoidal clock signal distribution using resonant transmission lines
IBM32 citations91
US5953515ASep 14, 1999
Pluggable electronic card presence detect scheme for use in parallel and serial vital detect product data (VPD) collection systems
IBM22 citations90
US7418068B2Aug 26, 2008
Data capture technique for high speed signaling
IBM18 citations88
US6276844B1Aug 21, 2001
Clustered, buffered simms and assemblies thereof
IBM53 citations87
US5786769AJul 28, 1998
Method and system for detecting the presence of adapter cards
IBM53 citations87
US6060905AMay 9, 2000
Variable voltage, variable impedance CMOS off-chip driver and receiver interface and circuits
IBM18 citations83
US6919515B2Jul 19, 2005
Stress accommodation in electronic device interconnect technology for millimeter contact locations
IBM15 citations82
US5771559AJun 30, 1998
Removable heat sink assembly process for a chip package
IBM10 citations74
US5949272ASep 7, 1999
Bidirectional off-chip driver with receiver bypass
IBM11 citations73
US7402053B2Jul 22, 2008
Pin grid array zero insertion force connectors configurable for supporting large pin counts
IBM6 citations72
US7322844B1Jan 29, 2008
Pin grid array zero insertion force connectors configurable for supporting large pin counts
IBM8 citations72
US7684224B2Mar 23, 2010
Structure comprising 3-dimensional integrated circuit architecture, circuit structure, and instructions for fabrication thereof
IBM2 citations63