Inventor
YAMAKAWA SEISHIRO
JP4 patents
Patents
4 patentsUS5407872AApr 18, 1995
Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material
MATSUSHITA ELECTRIC WORKS LTD44 citations94
US5284807AFeb 8, 1994
Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material
MATSUSHITA ELECTRIC WORKS LTD70 citations93
US5275878AJan 4, 1994
Composite dielectric and printed-circuit use substrate utilizing the same
MATSUSHITA ELECTRIC WORKS LTD23 citations91
US5334645AAug 2, 1994
Substrate for circuit board including the glass fibers as reinforcing material
MATSUSHITA ELECTRIC WORKS LTD10 citations72