Inventor
DAUBENSPECK TIMOTHY HARRISON
US31 patents
⚠️ This page may combine multiple inventors who share the name “DAUBENSPECK TIMOTHY HARRISON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
23 patentsUS6440834B2Aug 27, 2002
Method and structure for a semiconductor fuse
IBM44 citations96
US5935763AAug 10, 1999
Self-aligned pattern over a reflective layer
IBM213 citations96
US7868453B2Jan 11, 2011
Solder interconnect pads with current spreading layers
IBM15 citations92
US7482675B2Jan 27, 2009
Probing pads in kerf area for wafer testing
IBM40 citations92
US7459785B2Dec 2, 2008
Electrical interconnection structure formation
IBM28 citations92
US7439170B1Oct 21, 2008
Design structure for final via designs for chip stress reduction
IBM16 citations92
US6249038B1Jun 19, 2001
Method and structure for a semiconductor fuse
IBM28 citations92
US8361598B2Jan 29, 2013
Substrate anchor structure and method
IBM8 citations84
US7935408B2May 3, 2011
Substrate anchor structure and method
IBM10 citations84
US7911803B2Mar 22, 2011
Current distribution structure and method
IBM7 citations84
US7859122B2Dec 28, 2010
Final via structures for bond pad-solder ball interconnections
IBM14 citations84
US7462509B2Dec 9, 2008
Dual-sided chip attached modules
IBM10 citations84
US7256503B2Aug 14, 2007
Chip underfill in flip-chip technologies
IBM14 citations84
US5804464ASep 8, 1998
Semiconductor chip kerf clear method for forming semiconductor chips and electronic module therefore
IBM8 citations73
US5670428ASep 23, 1997
Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same
IBM6 citations73
US5644162AJul 1, 1997
Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module
IBM9 citations73
US7939390B2May 10, 2011
Gap capacitors for monitoring stress in solder balls in flip chip technology
IBM3 citations63
US7777339B2Aug 17, 2010
Semiconductor chips with reduced stress from underfill at edge of chip
IBM4 citations63
US7709876B2May 4, 2010
Gap capacitors for monitoring stress in solder balls in flip chip technology
IBM4 citations63
US7871920B2Jan 18, 2011
Semiconductor chips with reduced stress from underfill at edge of chip
IBM0 citations52
US7863734B2Jan 4, 2011
Dual-sided chip attached modules
IBM0 citations52
US7862987B2Jan 4, 2011
Method for forming an electrical structure comprising multiple photosensitive materials
IBM1 citations52
US7547576B2Jun 16, 2009
Solder wall structure in flip-chip technologies
IBM0 citations52
DAUBENSPECK TIMOTHY HARRISON
4 patentsUS8138602B2Mar 20, 2012
Solder interconnect pads with current spreading layers
DAUBENSPECK TIMOTHY HARRISON2 citations61
US8575007B2Nov 5, 2013
Selective electromigration improvement for high current C4s
DAUBENSPECK TIMOTHY HARRISON2 citations60
US9105465B2Aug 11, 2015
Wafer edge conditioning for thinned wafers
DAUBENSPECK TIMOTHY HARRISON0 citations50
US8819933B2Sep 2, 2014
Method for forming a current distribution structure
DAUBENSPECK TIMOTHY HARRISON0 citations50