Inventor
Sankarasubramanian Malavarayan
US5 patents
⚠️ This page may combine multiple inventors who share the name “Sankarasubramanian Malavarayan”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS11335616B2May 17, 2022
Substrate integrated inductor with composite magnetic resin layer
INTEL CORP0 citations60
US11887962B2Jan 30, 2024
Microelectronic structures including bridges
INTEL CORP0 citations58
US12040246B2Jul 16, 2024
Chip-scale package architectures containing a die back side metal and a solder thermal interface material
INTEL CORP1 citations55
US12183688B2Dec 31, 2024
Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE
INTEL CORP0 citations54