Inventor
DOWNES JR FRANCIS JOSEPH
US6 patents
Patents
6 patentsUS6569604B1May 27, 2003
Blind via formation in a photoimageable dielectric material
IBM18 citations91
US5940729AAug 17, 1999
Method of planarizing a curved substrate and resulting structure
IBM41 citations91
US6150255ANov 21, 2000
Method of planarizing a curved substrate and resulting structure
IBM11 citations72
US5994910ANov 30, 1999
Apparatus, and corresponding method, for stress testing wire bond-type semi-conductor chips
IBM9 citations72
US6043150AMar 28, 2000
Method for uniform plating of dendrites
IBM9 citations71
US5939786AAug 17, 1999
Uniform plating of dendrites
IBM10 citations71