Inventor
MOLLA JAYNAL ABEDIN
US10 patents
⚠️ This page may combine multiple inventors who share the name “MOLLA JAYNAL ABEDIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS5813870ASep 29, 1998
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
IBM55 citations94
US5940729AAug 17, 1999
Method of planarizing a curved substrate and resulting structure
IBM41 citations91
US5759046AJun 2, 1998
Dendritic interconnection system
IBM24 citations91
US6414509B1Jul 2, 2002
Method and apparatus for in-situ testing of integrated circuit chips
IBM18 citations79
US6150255ANov 21, 2000
Method of planarizing a curved substrate and resulting structure
IBM11 citations72
US5994910ANov 30, 1999
Apparatus, and corresponding method, for stress testing wire bond-type semi-conductor chips
IBM9 citations72
US6043150AMar 28, 2000
Method for uniform plating of dendrites
IBM9 citations71
US5939786AAug 17, 1999
Uniform plating of dendrites
IBM10 citations71