Inventor

HONG QI-ZHONG

US47 patents

⚠️ This page may combine multiple inventors who share the name “HONG QI-ZHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HONG QI-ZHONG

TEXAS INSTRUMENTS INC

Yield improvement of dual damascene fabrication through oxide filling

Passivation of inlaid metallization

Reduced temperature contact/via filling

Method of forming ultra-thin and conformal diffusion barriers encapsulating copper

Method of forming diffusion barriers encapsulating copper

Barrier-less plug structure

Integrated circuit interconnect and method

Method of forming a silicide layer using metallic impurities and pre-amorphization

Reduced temperature contact/via filling

Method of forming diffusion barriers for copper metallization in integrated cirucits

Multi-stage semiconductor cavity filling process

TiN+Al films and processes

Method to improve the texture of aluminum metallization

Method of improving texture of metal films in semiconductor integrated circuits

Method for producing barrier-less plug structures

Diffusion barrier trilayer for minimizing reaction between metallization layers of integrated circuits

Preferential lateral silicidation of gate with low source and drain silicon consumption

Multilevel via placement with improved yield in dual damascene interconnection

Selective aluminum plug formation and etchback process

Method of improving the texture of aluminum metallization for tungsten etch back processing

Si-rich surface layer capped diffusion barriers

Surface protective layer for improved silicide formation

Transistor having an improved salicided gate and method of construction

Barrier/liner with a SiNx-enriched surface layer on MOCVD prepared films

Method of forming a metal conductor and diffusion layer

Thin film resistor with punch-through vias

IC with thin film resistor with metal walls

Method of eliminating etch ridges in a dual damascene process

Semiconductor PMD layer dielectric

Method of making a surface protective layer for improved silicide formation

Thin film resistor with punch-through vias

Thin film resistor with punch-through vias

Method to improve silicide formation on polysilicon

Process for isolating an exposed conducting surface

Combined dry and wet etch for improved silicide formation

IC with thin film resistor with metal walls

Method for fabricating metal conductors and multi-level interconnects in a semiconductor device

Dielectric silicon nitride barrier deposition process for improved metal leakage and adhesion

Multilevel via placement with improved yield in dual damascene interconnection

System for improving thermal stability of copper damascene structure

Metal interconnect processing for an integrated circuit metal stack

Metal interconnect processing for a non-reactive metal stack

In-situ plasma treatment for thin film resistors

Device and method for a thin film resistor using a via retardation layer

IBM

Method of forming a film for a multilayer Semiconductor device for improving thermal stability of cobalt silicide using platinum or nitrogen

Method for controlling tensile and compressive stresses and mechanical problems in thin films on substrates

Thin film or solder ball including a metal and an oxide, nitride, or carbide precipitate of an expandable or contractible element