Inventor

HONG SUN HEE

US2 patents

Patents

2 patents

US6833629B2Dec 21, 2004

Dual cure B-stageable underfill for wafer level

NAT STARCH CHEM INVEST24 citations89

US7037399B2May 2, 2006

Underfill encapsulant for wafer packaging and method for its application

NAT STARCH CHEM INVEST13 citations81