Inventor
MCDONALD STEVEN M
US33 patents
⚠️ This page may combine multiple inventors who share the name “MCDONALD STEVEN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
32 patentsUS6169021B1Jan 2, 2001
Method of making a metallized recess in a substrate
MICRON TECHNOLOGY INC253 citations99
US6046094AApr 4, 2000
Method of forming wafer alignment patterns
MICRON TECHNOLOGY INC105 citations99
US7603772B2Oct 20, 2009
Methods of fabricating substrates including one or more conductive vias
MICRON TECHNOLOGY INC41 citations96
US6884642B2Apr 26, 2005
Wafer-level testing apparatus and method
MICRON TECHNOLOGY INC38 citations96
US6174590B1Jan 16, 2001
Isolation using an antireflective coating
MICRON TECHNOLOGY INC37 citations96
US6121133ASep 19, 2000
Isolation using an antireflective coating
MICRON TECHNOLOGY INC57 citations96
US5700732ADec 23, 1997
Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
MICRON TECHNOLOGY INC37 citations96
US7316063B2Jan 8, 2008
Methods of fabricating substrates including at least one conductive via
MICRON TECHNOLOGY INC21 citations93
US6744067B1Jun 1, 2004
Wafer-level testing apparatus and method
MICRON TECHNOLOGY INC34 citations93
US6495450B1Dec 17, 2002
Isolation using an antireflective coating
MICRON TECHNOLOGY INC17 citations93
US6423631B1Jul 23, 2002
Isolation using an antireflective coating
MICRON TECHNOLOGY INC14 citations93
US7030010B2Apr 18, 2006
Methods for creating electrophoretically insulated vias in semiconductive substrates and resulting structures
MICRON TECHNOLOGY INC12 citations92
US5925937AJul 20, 1999
Semiconductor wafer, wafer alignment patterns
MICRON TECHNOLOGY INC23 citations92
US7329899B2Feb 12, 2008
Wafer-level redistribution circuit
MICRON TECHNOLOGY INC9 citations84
US6137186AOct 24, 2000
Semiconductor wafer, wafer alignment patterns and method of forming wafer alignment patterns
MICRON TECHNOLOGY INC10 citations82
US7594322B2Sep 29, 2009
Methods of fabricating substrates including at least one conductive via
MICRON TECHNOLOGY INC6 citations74
US7105437B2Sep 12, 2006
Methods for creating electrophoretically insulated vias in semiconductive substrates
MICRON TECHNOLOGY INC4 citations74
US7105921B2Sep 12, 2006
Semiconductor assemblies having electrophoretically insulated vias
MICRON TECHNOLOGY INC4 citations74
US6635396B2Oct 21, 2003
Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabrication
MICRON TECHNOLOGY INC5 citations74
US6605502B2Aug 12, 2003
Isolation using an antireflective coating
MICRON TECHNOLOGY INC10 citations74
US6455212B1Sep 24, 2002
Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabrication
MICRON TECHNOLOGY INC10 citations74
US6313650B1Nov 6, 2001
Insert testing system
MICRON TECHNOLOGY INC10 citations74
US6248429B1Jun 19, 2001
Metallized recess in a substrate
MICRON TECHNOLOGY INC12 citations74
US6207529B1Mar 27, 2001
Semiconductor wafer,wafer alignment patterns and method of forming wafer alignment patterns
MICRON TECHNOLOGY INC5 citations74
US5798292AAug 25, 1998
Method of forming wafer alignment patterns
MICRON TECHNOLOGY INC7 citations74
US7498670B2Mar 3, 2009
Semiconductor structures having electrophoretically insulated vias
MICRON TECHNOLOGY INC2 citations63
US7470590B2Dec 30, 2008
Methods of forming semiconductor constructions
MICRON TECHNOLOGY INC5 citations63
US7115512B2Oct 3, 2006
Methods of forming semiconductor constructions
MICRON TECHNOLOGY INC2 citations63
US6777144B2Aug 17, 2004
Method for patterning a photoresist material for semiconductor component fabrication
MICRON TECHNOLOGY INC2 citations63
US6573013B2Jun 3, 2003
Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabrication
MICRON TECHNOLOGY INC2 citations63
US6482572B1Nov 19, 2002
Method for providing an alignment diffraction grating for photolithographic alignment during semiconductor fabrication
MICRON TECHNOLOGY INC3 citations63
US7335981B2Feb 26, 2008
Methods for creating electrophoretically insulated vias in semiconductive substrates
MICRON TECHNOLOGY INC0 citations52