Inventor
BOWERS MORRIS
US3 patents
Patents
3 patentsUS9698132B1Jul 4, 2017
Chip package stack up for heat dissipation
MOTOROLA MOBILITY LLC19 citations85
US9544861B1Jan 10, 2017
Apparatus and method for managing transmitter temperature and power within a group of communication devices
MOTOROLA MOBILITY LLC2 citations67
US10521394B2Dec 31, 2019
Apparatus and method for improving application performance within a group of communication devices
MOTOROLA MOBILITY LLC0 citations35