Inventor

Yu cheng-fei

TW2 patents

Patents

2 patents

US11670524B2Jun 6, 2023

Fully automated wafer debonding system and method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68

US12543526B2Feb 3, 2026

Fully automated wafer debonding system and method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58