Inventor

NAGATA KINJI

JP2 patents

Patents

2 patents

US7696613B2Apr 13, 2010

Multilayered wiring substrate including wiring layers and insulating layers and method of manufacturing the same

SHINKO ELECTRIC IND CO35 citations88

US7807560B2Oct 5, 2010

Solder bump forming method

SHINKO ELECTRIC IND CO0 citations47