Inventor
HE JUN
CN186 patents
⚠️ This page may combine multiple inventors who share the name “HE JUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
11 patentsUS6998216B2Feb 14, 2006
Mechanically robust interconnect for low-k dielectric material using post treatment
INTEL CORP33 citations93
US7087452B2Aug 8, 2006
Edge arrangements for integrated circuit chips
INTEL CORP59 citations92
US6919637B2Jul 19, 2005
Interconnect structure for an integrated circuit and method of fabrication
INTEL CORP30 citations92
US6838299B2Jan 4, 2005
Forming defect prevention trenches in dicing streets
INTEL CORP27 citations89
US7662674B2Feb 16, 2010
Methods of forming electromigration and thermal gradient based fuse structures
INTEL CORP10 citations84
US7071554B2Jul 4, 2006
Stress mitigation layer to reduce under bump stress concentration
INTEL CORP16 citations84
US7402519B2Jul 22, 2008
Interconnects having sealing structures to enable selective metal capping layers
INTEL CORP6 citations74
US7151051B2Dec 19, 2006
Interconnect structure for an integrated circuit and method of fabrication
INTEL CORP7 citations73
US9437545B2Sep 6, 2016
Interconnects having sealing structures to enable selective metal capping layers
INTEL CORP1 citations63
US7402509B2Jul 22, 2008
Method of forming self-passivating interconnects and resulting devices
INTEL CORP5 citations63
US7348283B2Mar 25, 2008
Mechanically robust dielectric film and stack
INTEL CORP5 citations63
HE JUN
6 patentsUSD903936SDec 1, 2020
Vape
HE JUN34 citations94
USD967282SOct 18, 2022
Rotating decompression ball
HE JUN7 citations86
USD965692SOct 4, 2022
Spinner toy
HE JUN3 citations73
US8058710B2Nov 15, 2011
Interconnects having sealing structures to enable selective metal capping layers
HE JUN6 citations73
US8704336B2Apr 22, 2014
Selective removal of on-die redistribution interconnects from scribe-lines
HE JUN6 citations71
USD1072510SApr 29, 2025
Inflatable sofa
HE JUN1 citations64
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS11073551B2Jul 27, 2021
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12349268B2Jul 1, 2025
Package component
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322716B2Jun 3, 2025
Heat dissipating features for laser drilling process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12313675B2May 27, 2025
Method and device for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12270852B2Apr 8, 2025
Method and system for wafer-level testing
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12237226B2Feb 25, 2025
Dicing method for stacked semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
UNIV ANHUI
4 patentsUS11315610B1Apr 26, 2022
Sense amplifier, memory and method for controlling sense amplifier
UNIV ANHUI6 citations73
US11894047B2Feb 6, 2024
Sense amplifier, memory and method for controlling sense amplifier
UNIV ANHUI5 citations72
US11887655B2Jan 30, 2024
Sense amplifier, memory, and method for controlling sense amplifier by configuring structures using switches
UNIV ANHUI3 citations72
US11423957B2Aug 23, 2022
Sense amplifier, memory and method for controlling a sense amplifier
UNIV ANHUI2 citations70
CHANGXIN MEMORY TECH INC
3 patentsIBM
2 patentsNOKIA SOLUTIONS & NETWORKS OY
2 patentsWAL MART STORES INC
2 patentsCOMPUTER ASS THINK INC
1 patentFORTINET INC
1 patentBaidu online network technology beijing co ltd
1 patentBATHE MARK
1 patentUNIV CALIFORNIA
1 patentPURE STORAGE INC
1 patentAMAZON TECH INC
1 patentANHUI ANUKI TECH CO LTD
1 patentEMC CORP
1 patentUNIV TIANJIN
1 patentCAMBRICON TECH CORP LTD
1 patentRES INST PETROLEUM PROCESSING
1 patentHUAWEI TECH CO LTD
1 patentUNIV ARIZONA
1 patentShowing the top 50 of 186 patents by PatentIndex Score.