Inventor

HAMASAKI AKIE

JP2 patents

⚠️ This page may combine multiple inventors who share the name “HAMASAKI AKIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LINTEC CORP

1 patent

US7935574B2May 3, 2011

Marking method and sheet for both protective film forming and dicing

LINTEC CORP32 citations89

HAMASAKI AKIE

1 patent

US8587130B2Nov 19, 2013

Die-sorting sheet and method for transporting chips having adhesive layer

HAMASAKI AKIE18 citations73