Inventor
KIM YEONG-KWAN
KR18 patents
⚠️ This page may combine multiple inventors who share the name “KIM YEONG-KWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS6468924B2Oct 22, 2002
Methods of forming thin films by atomic layer deposition
SAMSUNG ELECTRONICS CO LTD930 citations99
US6391803B1May 21, 2002
Method of forming silicon containing thin films by atomic layer deposition utilizing trisdimethylaminosilane
SAMSUNG ELECTRONICS CO LTD964 citations99
US6270572B1Aug 7, 2001
Method for manufacturing thin film using atomic layer deposition
SAMSUNG ELECTRONICS CO LTD1,052 citations99
US6207487B1Mar 27, 2001
Method for forming dielectric film of capacitor having different thicknesses partly
SAMSUNG ELECTRONICS CO LTD426 citations99
US6144060ANov 7, 2000
Integrated circuit devices having buffer layers therein which contain metal oxide stabilized by heat treatment under low temperature
SAMSUNG ELECTRONICS CO LTD457 citations99
US6828218B2Dec 7, 2004
Method of forming a thin film using atomic layer deposition
SAMSUNG ELECTRONICS CO LTD96 citations98
US6576053B1Jun 10, 2003
Method of forming thin film using atomic layer deposition method
SAMSUNG ELECTRONICS CO LTD297 citations98
US6509601B1Jan 21, 2003
Semiconductor memory device having capacitor protection layer and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD231 citations98
US6335240B1Jan 1, 2002
Capacitor for a semiconductor device and method for forming the same
SAMSUNG ELECTRONICS CO LTD468 citations98
US6489214B2Dec 3, 2002
Method for forming a capacitor of a semiconductor device
SAMSUNG ELECTRONICS CO LTD56 citations96
US6162501ADec 19, 2000
Method for manufacturing thin films of multi-element group oxide or nitride
SAMSUNG ELECTRONICS CO LTD66 citations96
US6570253B1May 27, 2003
Multi-layer film for a thin film structure and a capacitor using the same
SAMSUNG ELECTRONICS CO LTD30 citations92
US6833310B2Dec 21, 2004
Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US6828616B2Dec 7, 2004
Integrated circuit devices that utilize doped Poly-Si1−xGex conductive plugs as interconnects
SAMSUNG ELECTRONICS CO LTD5 citations72
US7052918B2May 30, 2006
Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof
SAMSUNG ELECTRONICS CO LTD2 citations63
US7544607B2Jun 9, 2009
Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7316954B2Jan 8, 2008
Methods of fabricating integrated circuit devices that utilize doped poly-Si1−xGex conductive plugs as interconnects
SAMSUNG ELECTRONICS CO LTD0 citations51