P

Inventor

KIM YEONG-KWAN

KR18 patents
⚠️ This page may combine multiple inventors who share the name “KIM YEONG-KWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

17 patents
US6468924B2Oct 22, 2002

Methods of forming thin films by atomic layer deposition

SAMSUNG ELECTRONICS CO LTD930 citations99
US6391803B1May 21, 2002

Method of forming silicon containing thin films by atomic layer deposition utilizing trisdimethylaminosilane

SAMSUNG ELECTRONICS CO LTD964 citations99
US6270572B1Aug 7, 2001

Method for manufacturing thin film using atomic layer deposition

SAMSUNG ELECTRONICS CO LTD1,052 citations99
US6207487B1Mar 27, 2001

Method for forming dielectric film of capacitor having different thicknesses partly

SAMSUNG ELECTRONICS CO LTD426 citations99
US6144060ANov 7, 2000

Integrated circuit devices having buffer layers therein which contain metal oxide stabilized by heat treatment under low temperature

SAMSUNG ELECTRONICS CO LTD457 citations99
US6828218B2Dec 7, 2004

Method of forming a thin film using atomic layer deposition

SAMSUNG ELECTRONICS CO LTD96 citations98
US6576053B1Jun 10, 2003

Method of forming thin film using atomic layer deposition method

SAMSUNG ELECTRONICS CO LTD297 citations98
US6509601B1Jan 21, 2003

Semiconductor memory device having capacitor protection layer and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD231 citations98
US6335240B1Jan 1, 2002

Capacitor for a semiconductor device and method for forming the same

SAMSUNG ELECTRONICS CO LTD468 citations98
US6489214B2Dec 3, 2002

Method for forming a capacitor of a semiconductor device

SAMSUNG ELECTRONICS CO LTD56 citations96
US6162501ADec 19, 2000

Method for manufacturing thin films of multi-element group oxide or nitride

SAMSUNG ELECTRONICS CO LTD66 citations96
US6570253B1May 27, 2003

Multi-layer film for a thin film structure and a capacitor using the same

SAMSUNG ELECTRONICS CO LTD30 citations92
US6833310B2Dec 21, 2004

Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations74
US6828616B2Dec 7, 2004

Integrated circuit devices that utilize doped Poly-Si1−xGex conductive plugs as interconnects

SAMSUNG ELECTRONICS CO LTD5 citations72
US7052918B2May 30, 2006

Multi-layer film for thin film structure, capacitor using the same and fabrication method thereof

SAMSUNG ELECTRONICS CO LTD2 citations63
US7544607B2Jun 9, 2009

Semiconductor device having thin film formed by atomic layer deposition and method for fabricating the same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7316954B2Jan 8, 2008

Methods of fabricating integrated circuit devices that utilize doped poly-Si1−xGex conductive plugs as interconnects

SAMSUNG ELECTRONICS CO LTD0 citations51

APPLIED MATERIALS INC

1 patent