Inventor
DEBOER SCOTT JEFFREY
US45 patents
⚠️ This page may combine multiple inventors who share the name “DEBOER SCOTT JEFFREY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
44 patentsUS6251802B1Jun 26, 2001
Methods of forming carbon-containing layers
MICRON TECHNOLOGY INC262 citations99
US5910880AJun 8, 1999
Semiconductor circuit components and capacitors
MICRON TECHNOLOGY INC98 citations99
US6858523B2Feb 22, 2005
Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
MICRON TECHNOLOGY INC51 citations96
US6458645B2Oct 1, 2002
Capacitor having tantalum oxynitride film and method for making same
MICRON TECHNOLOGY INC41 citations96
US6191443B1Feb 20, 2001
Capacitors, methods of forming capacitors, and DRAM memory cells
MICRON TECHNOLOGY INC52 citations96
US6162744ADec 19, 2000
Method of forming capacitors having high-K oxygen containing capacitor dielectric layers, method of processing high-K oxygen containing dielectric layers, method of forming a DRAM cell having having high-K oxygen containing capacitor dielectric layers
MICRON TECHNOLOGY INC62 citations96
US6146959ANov 14, 2000
Method of forming capacitors containing tantalum
MICRON TECHNOLOGY INC64 citations96
US6864527B2Mar 8, 2005
Capacitor having tantalum oxynitride film and method for making same
MICRON TECHNOLOGY INC18 citations93
US6794703B1Sep 21, 2004
High pressure reoxidation/anneal of high dielectric constant
MICRON TECHNOLOGY INC13 citations93
US6635530B2Oct 21, 2003
Methods of forming gated semiconductor assemblies
MICRON TECHNOLOGY INC16 citations93
US6593616B2Jul 15, 2003
Buried bit line memory circuitry
MICRON TECHNOLOGY INC14 citations93
US6486020B1Nov 26, 2002
High pressure reoxidation/anneal of high dielectric constant materials
MICRON TECHNOLOGY INC26 citations93
US6440860B1Aug 27, 2002
Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
MICRON TECHNOLOGY INC21 citations93
US6337274B1Jan 8, 2002
Methods of forming buried bit line memory circuitry
MICRON TECHNOLOGY INC21 citations93
US6282080B1Aug 28, 2001
Semiconductor circuit components and capacitors
MICRON TECHNOLOGY INC25 citations93
US6082375AJul 4, 2000
Method of processing internal surfaces of a chemical vapor deposition reactor
MICRON TECHNOLOGY INC17 citations93
US6400552B2Jun 4, 2002
Capacitor with conductively doped Si-Ge alloy electrode
MICRON TECHNOLOGY INC13 citations82
US7206215B2Apr 17, 2007
Antifuse having tantalum oxynitride film and method for making same
MICRON TECHNOLOGY INC9 citations74
US7045277B2May 16, 2006
Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
MICRON TECHNOLOGY INC7 citations74
US7038265B2May 2, 2006
Capacitor having tantalum oxynitride film and method for making same
MICRON TECHNOLOGY INC4 citations74
US7009264B1Mar 7, 2006
Selective spacer to prevent metal oxide formation during polycide reoxidation
MICRON TECHNOLOGY INC8 citations74
US6773981B1Aug 10, 2004
Methods of forming capacitors
MICRON TECHNOLOGY INC10 citations74
US6756634B2Jun 29, 2004
Gated semiconductor assemblies
MICRON TECHNOLOGY INC12 citations74
US6693345B2Feb 17, 2004
Semiconductor wafer assemblies comprising photoresist over silicon nitride materials
MICRON TECHNOLOGY INC6 citations74
US6627508B1Sep 30, 2003
Method of forming capacitors containing tantalum
MICRON TECHNOLOGY INC7 citations74
US6610211B1Aug 26, 2003
Method of processing internal surfaces of a chemical vapor deposition reactor
MICRON TECHNOLOGY INC7 citations74
US6417559B1Jul 9, 2002
Semiconductor wafer assemblies comprising photoresist over silicon nitride materials
MICRON TECHNOLOGY INC10 citations74
US6391710B1May 21, 2002
Methods of forming capacitors
MICRON TECHNOLOGY INC13 citations74
US6368962B2Apr 9, 2002
Semiconductor processing method of forming a conductive line, and buried bit line memory circuitry
MICRON TECHNOLOGY INC8 citations74
US6323139B1Nov 27, 2001
Semiconductor processing methods of forming photoresist over silicon nitride materials
MICRON TECHNOLOGY INC5 citations74
US7078328B2Jul 18, 2006
Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
MICRON TECHNOLOGY INC1 citations63
US7067411B2Jun 27, 2006
Method to prevent metal oxide formation during polycide reoxidation
MICRON TECHNOLOGY INC4 citations63
US7057263B2Jun 6, 2006
Semiconductor wafer assemblies comprising photoresist over silicon nitride materials
MICRON TECHNOLOGY INC2 citations63
US6326321B1Dec 4, 2001
Methods of forming a layer of silicon nitride in semiconductor fabrication processes
MICRON TECHNOLOGY INC3 citations63
US6316372B1Nov 13, 2001
Methods of forming a layer of silicon nitride in a semiconductor fabrication process
MICRON TECHNOLOGY INC3 citations63
US6194321B1Feb 27, 2001
Semiconductor processing methods utilizing boron and nitrogen, and semiconductor wafers comprising boron and nitrogen
MICRON TECHNOLOGY INC6 citations63
US6528436B1Mar 4, 2003
Method of forming silicon nitride layer directly on HSG polysilicon
MICRON TECHNOLOGY INC2 citations62
US7638436B2Dec 29, 2009
Semiconductor processing methods of transferring patterns from patterned photoresists to materials
MICRON TECHNOLOGY INC0 citations52
US7435688B2Oct 14, 2008
Semiconductor processing methods of transferring patterns from patterned photoresists to materials, and structures comprising silicon nitride
MICRON TECHNOLOGY INC0 citations52
US7208805B2Apr 24, 2007
Structures comprising a layer free of nitrogen between silicon nitride and photoresist
MICRON TECHNOLOGY INC0 citations52
US7141850B2Nov 28, 2006
Gated semiconductor assemblies and methods of forming gated semiconductor assemblies
MICRON TECHNOLOGY INC0 citations52
US7115926B1Oct 3, 2006
Capacitor constructions, DRAM constructions, and semiconductive material assemblies
MICRON TECHNOLOGY INC0 citations52
US6677661B1Jan 13, 2004
Semiconductive wafer assemblies
MICRON TECHNOLOGY INC0 citations52
US6670288B1Dec 30, 2003
Methods of forming a layer of silicon nitride in a semiconductor fabrication process
MICRON TECHNOLOGY INC0 citations52