Inventor
HOWLAND JR WILLIAM H
US10 patents
Patents
10 patentsUS7023231B2Apr 4, 2006
Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof
SOLID STATE MEASUREMENTS INC112 citations93
US7005307B2Feb 28, 2006
Apparatus and method for detecting soft breakdown of a dielectric layer of a semiconductor wafer
SOLID STATE MEASUREMENTS INC3 citations61
US7250313B2Jul 31, 2007
Method of detecting un-annealed ion implants
SOLID STATE MEASUREMENTS INC3 citations60
US6803780B2Oct 12, 2004
Sample chuck with compound construction
SOLID STATE MEASUREMENTS INC2 citations60
US7007408B2Mar 7, 2006
Method and apparatus for removing and/or preventing surface contamination of a probe
SOLID STATE MEASUREMENTS INC2 citations55
US7282941B2Oct 16, 2007
Method of measuring semiconductor wafers with an oxide enhanced probe
SOLID STATE MEASUREMENTS INC0 citations50
US7063992B2Jun 20, 2006
Semiconductor substrate surface preparation using high temperature convection heating
SOLID STATE MEASUREMENTS INC1 citations45
US7304490B2Dec 4, 2007
In-situ wafer and probe desorption using closed loop heating
SOLID STATE MEASUREMENTS INC1 citations44
US7190186B2Mar 13, 2007
Method and apparatus for determining concentration of defects and/or impurities in a semiconductor wafer
SOLID STATE MEASUREMENTS INC1 citations44
US7026837B2Apr 11, 2006
Method and apparatus for determining the dielectric constant of a low permittivity dielectric on a semiconductor wafer
SOLID STATE MEASUREMENTS INC0 citations30