Inventor
MARTIN MELVIN
DE5 patents
Patents
5 patentsUS10636742B2Apr 28, 2020
Very thin embedded trace substrate-system in package (SIP)
DIALOG SEMICONDUCTOR UK LTD4 citations70
US11075167B2Jul 27, 2021
Pillared cavity down MIS-SIP
DIALOG SEMICONDUCTOR UK LTD2 citations68
US10410996B2Sep 10, 2019
Integrated circuit package for assembling various dice in a single IC package
DIALOG SEMICONDUCTOR UK LTD2 citations60
US11309255B2Apr 19, 2022
Very thin embedded trace substrate-system in package (SIP)
DIALOG SEMICONDUCTOR UK LTD0 citations59
US11532489B2Dec 20, 2022
Pillared cavity down MIS-SiP
DIALOG SEMICONDUCTOR UK LTD0 citations57