Inventor
YEH WEN-LIANG
TW6 patents
Patents
6 patentsUS10461146B1Oct 29, 2019
Package structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP10 citations82
US10660202B1May 19, 2020
Carrier structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP4 citations71
US11348869B2May 31, 2022
Method of manufacturing chip packaging structure
UNIMICRON TECHNOLOGY CORP0 citations61
US10879167B2Dec 29, 2020
Chip packaging structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations50
US11201123B2Dec 14, 2021
Substrate structure and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49
US10999939B2May 4, 2021
Circuit carrier board and manufacturing method thereof
UNIMICRON TECHNOLOGY CORP0 citations49