Inventor

CHOI WON-KYOUNG

KR63 patents

⚠️ This page may combine multiple inventors who share the name “CHOI WON-KYOUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI WON-KYOUNG

HYUNDAI MOTOR CO LTD

Fail-safe method and apparatus for high voltage parts in a hybrid vehicle

Bidirectional powering on-board charger, vehicle power supply system including the same, and control method thereof

Inverter control method and system for eco-friendly vehicle

Vehicle power control method and system for jump-start

Control method and system for charging high voltage battery of vehicle

Method of diagnosing fault by using impedance of output terminal of power supply device for environmentally-friendly vehicle

Inverter control method and system for eco-friendly vehicle

Method for controlling interior permanent magnet synchronous motor

Method and system for compensating for current sensor offset of inverter

Method for controlling cooling of power converter for hybrid electric vehicle

Method and system for controlling vehicular direct current converter

System and method for controlling a relay of an auxiliary battery

Voltage drop compensation control system and method of power supply device

Low voltage DC-DC converter of eco friendly vehicle

System, method and apparatus for protecting OBC output terminal

System and method for controlling LDC of hybrid vehicle

STATS CHIPPAC LTD

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Semiconductor device and method of forming double-sided fan-out wafer level package

Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits

Semiconductor device and method of forming fine pitch RDL over semiconductor die in fan-out package

Semiconductor device and method of forming low profile fan-out package with vertical interconnection units

Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure

Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation

Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure

Semiconductor device and method of reducing warpage using a silicon to encapsulant ratio

STATS CHIPPAC PTE LTD

Semiconductor device and method of forming electromagnetic (EM) shielding for LC circuits

Semiconductor device and method of forming low profile fan-out package with vertical interconnection units

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Semiconductor device and method of forming microelectromechanical systems (MEMS) package

Method of packaging thin die and semiconductor device including thin die

SAMSUNG ELECTRONICS CO LTD

Mirror package and method of manufacturing the mirror package

Optical scanner package with optical noise reduction

Optical scanner package having heating dam

SnAgAu solder bumps, method of manufacturing the same, and method of bonding light emitting device using the same

Method of manufacturing an image drum

Toner adsorption image forming apparatus

Image drum for selectively absorbing toner thereon

CHOI WON KYOUNG

Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation

Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief

Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure

Integrated circuit system with debonding adhesive and method of manufacture thereof

SONG HONG SEOK

Motor drive system for hybrid vehicle and method for controlling the same in the event of failure

HAN BYUNG JOON

Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy

JEON WOO YONG

Method for compensating nonlinearity of resolver for hybrid and fuel cell vehicles

JCET SEMICONDUCTOR SHAOXING CO LTD

Semiconductor device and method of forming double-sided fan-out wafer level package

CHOI WON-KYOUNG

Soldering structure and method using Zn