Inventor
CHENG MING-HSIANG
TW18 patents
⚠️ This page may combine multiple inventors who share the name “CHENG MING-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
7 patentsUS9859232B1Jan 2, 2018
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG18 citations92
US7279789B2Oct 9, 2007
Thermally enhanced three-dimensional package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG44 citations92
US7699547B2Apr 20, 2010
Compact camera module
ADVANCED SEMICONDUCTOR ENG2 citations62
US7446295B2Nov 4, 2008
Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip
ADVANCED SEMICONDUCTOR ENG3 citations62
US7429783B2Sep 30, 2008
Image sensor package
ADVANCED SEMICONDUCTOR ENG4 citations62
US8368216B2Feb 5, 2013
Semiconductor package
ADVANCED SEMICONDUCTOR ENG1 citations51
US10332848B2Jun 25, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations50
CHANG HSIAO-CHUAN
3 patentsUS8274149B2Sep 25, 2012
Semiconductor device package having a buffer structure and method of fabricating the same
CHANG HSIAO-CHUAN14 citations82
US8421242B2Apr 16, 2013
Semiconductor package
CHANG HSIAO-CHUAN2 citations60
US8222726B2Jul 17, 2012
Semiconductor device package having a jumper chip and method of fabricating the same
CHANG HSIAO-CHUAN0 citations49
LAI YI-SHAO
3 patentsUS8072064B1Dec 6, 2011
Semiconductor package and method for making the same
LAI YI-SHAO9 citations81
US8592982B2Nov 26, 2013
Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
LAI YI-SHAO0 citations46
US8253431B2Aug 28, 2012
Apparatus and method for testing non-contact pads of a semiconductor device to be tested
LAI YI-SHAO1 citations43