Inventor
CHIU CHAO-WEI
TW9 patents
Patents
9 patentsUS12368086B2Jul 22, 2025
Package structure having thermoelectric cooler
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12564008B2Feb 24, 2026
Method and treatment system for uniform processing of semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266559B2Apr 1, 2025
Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11791192B2Oct 17, 2023
Workpiece holder, wafer chuck, wafer holding method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12543612B2Feb 3, 2026
Semiconductor devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12051639B2Jul 30, 2024
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12051655B2Jul 30, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11664300B2May 30, 2023
Fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12354929B2Jul 8, 2025
Package structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48