Inventor
WOO JUNG-HWAN
KR3 patents
Patents
3 patentsUS7215008B2May 8, 2007
In-line apparatus and method for manufacturing double-sided stacked multi-chip packages
SAMSUNG ELECTRONICS CO LTD13 citations82
US7624498B2Dec 1, 2009
Apparatus for detaching a semiconductor chip from a tape
SAMSUNG ELECTRONICS CO LTD10 citations81
US7650687B2Jan 26, 2010
Die attaching apparatus
SAMSUNG ELECTRONICS CO LTD7 citations70