Inventor
GOTOH MASASHI
JP45 patents
⚠️ This page may combine multiple inventors who share the name “GOTOH MASASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
31 patentsUS6204454B1Mar 20, 2001
Wiring board and process for the production thereof
TDK CORP115 citations97
US6181015B1Jan 30, 2001
Face-down mounted surface acoustic wave device
TDK CORP115 citations97
US6417026B2Jul 9, 2002
Acoustic wave device face-down mounted on a substrate
TDK CORP73 citations96
US6460591B1Oct 8, 2002
Ultrasonic bonding method and ultrasonic bonding apparatus
TDK CORP27 citations92
US6282781B1Sep 4, 2001
Resin package fabrication process
TDK CORP42 citations92
US6281436B1Aug 28, 2001
Encapsulated surface mounting electronic part
TDK CORP18 citations84
US6730858B2May 4, 2004
Circuit board having bonding areas to be joined with bumps by ultrasonic bonding
TDK CORP14 citations83
US10186360B2Jan 22, 2019
Arcuate magnet piece, permanent magnet piece, permanent magnet assembly, permanent magnet application device, and motor
TDK CORP8 citations81
US6565687B2May 20, 2003
Ultrasonic bonding method
TDK CORP6 citations74
US6549101B2Apr 15, 2003
Dielectric filter, and method of manufacturing the same
TDK CORP7 citations73
US6471783B1Oct 29, 2002
Production method of electronic parts and water treatment apparatus
TDK CORP8 citations73
US6320739B1Nov 20, 2001
Electronic part and manufacturing method therefor
TDK CORP9 citations73
US6263565B1Jul 24, 2001
Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same
TDK CORP10 citations73
US6382495B2May 7, 2002
Chip junction nozzle
TDK CORP5 citations71
US6189760B1Feb 20, 2001
Chip junction nozzle
TDK CORP8 citations71
US7589416B2Sep 15, 2009
Substrate, electronic component, and manufacturing method of these
TDK CORP2 citations63
US7237331B2Jul 3, 2007
Electronic part manufacturing method and electronic part
TDK CORP2 citations62
US6642449B2Nov 4, 2003
Electronic component and manufacturing method thereof
TDK CORP3 citations62
US6548758B2Apr 15, 2003
Electronic component and manufacturing method thereof
TDK CORP3 citations62
US7594809B2Sep 29, 2009
Molding die unit
TDK CORP3 citations60
US9465230B2Oct 11, 2016
Lens holding device
TDK CORP2 citations59
US8033314B2Oct 11, 2011
Method for producing sintered magnet
TDK CORP2 citations56
US7883614B2Feb 8, 2011
Method of manufacturing electronic part and electronic part
TDK CORP1 citations52
US7651940B2Jan 26, 2010
Electronic part producing method and electronic part
TDK CORP0 citations52
US7371682B2May 13, 2008
Production method for electronic component and electronic component
TDK CORP1 citations52
US6749183B2Jun 15, 2004
Production method of electronic parts and water treatment apparatus
TDK CORP1 citations51
US9395510B2Jul 19, 2016
Lens holding device for camera module
TDK CORP1 citations48
US7563342B2Jul 21, 2009
Method of manufacturing laminated substrate
TDK CORP0 citations42
US7987590B2Aug 2, 2011
Method for manufacturing an electronic part
TDK CORP0 citations41
US7543375B2Jun 9, 2009
Process for filling via hole in a substrate
TDK CORP0 citations41
US7901200B2Mar 8, 2011
Molding apparatus
TDK CORP0 citations39
INT INST CANCER IMMUNOLOGY INC
5 patentsUS7939627B2May 10, 2011
Peptides comprising an epitope of the wilms tumor gene product
INT INST CANCER IMMUNOLOGY INC21 citations92
US7666985B2Feb 23, 2010
HLA-A24-restricted cancer antigen peptides
INT INST CANCER IMMUNOLOGY INC31 citations91
US7378384B2May 27, 2008
WT1 substitution peptides
INT INST CANCER IMMUNOLOGY INC22 citations89
US9765114B2Sep 19, 2017
Method for cancer immunotherapy
INT INST CANCER IMMUNOLOGY INC2 citations73
US9273148B2Mar 1, 2016
Method for cancer immunotherapy
INT INST CANCER IMMUNOLOGY INC2 citations63