Inventor
GARDECKI LEONARD J
US6 patents
Patents
6 patentsUS6706621B2Mar 16, 2004
Wafer integrated rigid support ring
IBM29 citations88
US7670437B2Mar 2, 2010
Mask and substrate alignment for solder bump process
IBM8 citations77
US7288492B2Oct 30, 2007
Method for forming interconnects on thin wafers
IBM7 citations70
US6951775B2Oct 4, 2005
Method for forming interconnects on thin wafers
IBM2 citations59
US7138326B2Nov 21, 2006
Wafer integrated rigid support ring
IBM3 citations58
US7410919B2Aug 12, 2008
Mask and substrate alignment for solder bump process
IBM0 citations45