Inventor

TAKEI TOKIO

JP6 patents

⚠️ This page may combine multiple inventors who share the name “TAKEI TOKIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINETSU HANDOTAI KK

5 patents

US6583029B2Jun 24, 2003

Production method for silicon wafer and SOI wafer, and SOI wafer

SHINETSU HANDOTAI KK60 citations95

US5071785ADec 10, 1991

Method for preparing a substrate for forming semiconductor devices by bonding warped wafers

SHINETSU HANDOTAI KK64 citations95

US7727860B2Jun 1, 2010

Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer

SHINETSU HANDOTAI KK21 citations92

US6110391AAug 29, 2000

Method of manufacturing a bonding substrate

SHINETSU HANDOTAI KK28 citations92

US5938512AAug 17, 1999

Wafer holding jig

SHINETSU HANDOTAI KK33 citations92

ITO YATSUO

1 patent

US5340435AAug 23, 1994

Bonded wafer and method of manufacturing it

ITO YATSUO69 citations91