Inventor
TSANG CHI-HWA
US13 patents
⚠️ This page may combine multiple inventors who share the name “TSANG CHI-HWA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS4713141ADec 15, 1987
Anisotropic plasma etching of tungsten
INTEL CORP70 citations95
US4690728ASep 1, 1987
Pattern delineation of vertical load resistor
INTEL CORP53 citations92
US4666555AMay 19, 1987
Plasma etching of silicon using fluorinated gas mixtures
INTEL CORP39 citations92
US7070687B2Jul 4, 2006
Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
INTEL CORP26 citations91
US5358891AOct 25, 1994
Trench isolation with planar topography and method of fabrication
INTEL CORP56 citations91
US7432200B2Oct 7, 2008
Filling narrow and high aspect ratio openings using electroless deposition
INTEL CORP24 citations90
US5262279ANov 16, 1993
Dry process for stripping photoresist from a polyimide surface
INTEL CORP41 citations88
US6761625B1Jul 13, 2004
Reclaiming virgin test wafers
INTEL CORP16 citations78
US7622382B2Nov 24, 2009
Filling narrow and high aspect ratio openings with electroless deposition
INTEL CORP7 citations71
US11869894B2Jan 9, 2024
Metallization structures for stacked device connectivity and their methods of fabrication
INTEL CORP0 citations62
US11430814B2Aug 30, 2022
Metallization structures for stacked device connectivity and their methods of fabrication
INTEL CORP0 citations62
US11417567B2Aug 16, 2022
Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom
INTEL CORP0 citations52